NOVEL MEMS APPARATUS FOR IN SITU THERMO-MECHANICAL TENSILE TESTING OF MATERIALS AT THE MICRO- AND NANO-SCALE

We present, for the first time, a MEMS-based test methodology that potentially enables elevated-temperature mechanical tensile testing of nano-and micro-scale samples within a SEM or TEM (T > 500 degrees C). Importantly, the test methodology allows for the samples to be fabricated separately from the MEMS-apparatus, a significant advancement from other test devices developed by some of the present authors [1]. Therefore the test methodology should be applicable to the study of a wide range of materials. Other advancements found in the methodology include a co-fabricated force calibration device, and a built-in thermocouple sensor to measure the stage temperature close to the sample.