Wetting in the Au-Sn system

被引:63
|
作者
Yin, L
Meschter, SJ
Singler, TJ
机构
[1] SUNY Binghamton, Dept Mech Engn, Binghamton, NY 13902 USA
[2] BAE Syst, Failure Anal Lab, Johnson City, NY 13790 USA
关键词
Au-Sn; wetting; intermetallic compounds; contact angle; interface diffusion; convection;
D O I
10.1016/j.actamat.2004.02.033
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The isothermal spreading of liquid Sri on Au substrates was studied over the temperature range of 250-430 degreesC using the sessile drop technique in a gaseous flux atmosphere. Digital video imaging was used to record the spreading kinetics, and rapid quenching and metallographic cross-sectioning was used to characterize dissolution and compound formation. Observations showed that three temperature/composition regimes gave rise to their own unique spreading behaviors. At low temperatures/Au concentrations, limited spreading was accompanied by nearly complete isothermal solidification. At intermediate temperatures/Au concentrations, rapid spreading and concurrent appearance of a transient intermetallic compound were observed. At higher temperatures/Au concentrations, extensive spreading was observed in the form of a thick film (similar to20 mum) supplied by a central dissolution well whose L/V interface undergoes a global curvature reversal. We discuss the contact line mobility and other mechanisms that affect wetting and spreading behaviors: fluid flow, mass transport and metallurgical reaction. (C) 2004 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
引用
收藏
页码:2873 / 2888
页数:16
相关论文
共 50 条
  • [1] Thermodynamic evaluation of the Au-Sn system
    Grolier, Vincent
    Schmid-Fetzer, Rainer
    INTERNATIONAL JOURNAL OF MATERIALS RESEARCH, 2007, 98 (09) : 797 - 806
  • [2] Thermodynamic evaluation of the Au-Sn system
    Grolier, Vincent
    Schmid-Fetzer, Rainer
    Zeitschrift fuer Metallkunde/Materials Research and Advanced Techniques, 2007, 98 (09): : 797 - 806
  • [3] A THERMODYNAMIC EVALUATION OF THE AU-SN SYSTEM
    CHEVALIER, PY
    THERMOCHIMICA ACTA, 1988, 130 : 1 - 13
  • [4] Wetting behavior of eutectic Au-Sn solder on Ni/Au metallization at different temperatures
    Wang, Jie
    Wu, Yiping
    Chen, Weimin
    Xie, Yangquan
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2022, 33 (04) : 1774 - 1782
  • [6] A METASTABLE EUTECTIC REACTION IN AU-SN SYSTEM
    ISHIHARA, KN
    GOHCHI, H
    SHINGU, PH
    JOURNAL OF METALS, 1985, 37 (11): : A81 - A81
  • [7] ON THERMODYNAMIC PROPERTIES OF INTERMEDIATE PHASES IN SYSTEM AU-SN
    MISRA, S
    HOWLETT, BW
    BEVER, MB
    TRANSACTIONS OF THE METALLURGICAL SOCIETY OF AIME, 1965, 233 (04): : 749 - &
  • [8] Mechanical properties of intermetallic compounds in the Au-Sn system
    Chromik, RR
    Wang, DN
    Shugar, A
    Limata, L
    Notis, MR
    Vinci, RP
    JOURNAL OF MATERIALS RESEARCH, 2005, 20 (08) : 2161 - 2172
  • [9] Phase equilibria and physical properties in the Au-Sn system
    1600, Publ by ASM Int, Materials Park, OH, USA
  • [10] Au-Sn合金电镀
    王丽丽
    半导体技术, 1999, (05) : 36 - 37+42