Effects of chloride ion on the texture of copper and Cu-ZrB2 coatings electrodeposited from copper nitrate solution in different plating modes

For the first time, the texture of copper and Cu-ZrB2 coatings produced from copper nitrate solution was studied. Chloride ion shows different effects on the deposit texture under direct current (DC) and pulse current (PC) conditions. Copper deposits are strongly < 220 > textured in DC plating with and without chloride ion. While in PC condition, the predominant texture shifts from < 220 > to < 200 > as the chloride ion concentration exceeds 20 mg/l. The addition of ZrB2 particles enhances the cathodic polarization of copper deposition, which improves the growth of (111) plane. However, this improvement can be eliminated by further addition of chloride ion.