Characteristics of Thermosetting Polymer Nanocomposites: Siloxane-Imide-Containing Benzoxazine with Silsesquioxane Epoxy Resins

被引：15

作者：

Lin, Chih-Hao ^{[1
]}

Chen, Wen-Bin ^{[2
]}

Whang, Wha-Tzong ^{[1
]}

Chen, Chun-Hua ^{[1
]}

机构：

[1] Natl Chiao Tung Univ, Dept Mat Sci & Engn, Hsinchu 300093, Taiwan

[2] Ind Technol Res Inst, Mat & Chem Res Labs, Hsinchu 31040, Taiwan

来源：

POLYMERS | 2020年 / 12卷 / 11期

关键词：

polysiloxane-imide-containing benzoxazine; polyhedral oligomeric silsesquioxane epoxy; double-decker silsesquioxane epoxy; polymer nanocomposite; POLYHEDRAL OLIGOMERIC SILSESQUIOXANE; MECHANICAL CHARACTERIZATION; POLYBENZOXAZINE; POSS; FABRICATION; COPOLYMERS; MEMBRANES; SURFACES; KINETICS; WATER;

D O I：

10.3390/polym12112510

中图分类号：

O63 [高分子化学（高聚物）];

学科分类号：

070305 ; 080501 ; 081704 ;

摘要：

A series of innovative thermosetting polymer nanocomposites comprising of polysiloxane-imide-containing benzoxazine (PSiBZ) as the matrix and double-decker silsesquioxane (DDSQ) epoxy or polyhedral oligomeric silsesquioxane (POSS) epoxy were prepared for improving thermosetting performance. Thermomechanical and dynamic mechanical characterizations indicated that both DDSQ and POSS could effectively lower the coefficient of thermal expansion by up to approximately 34% and considerably increase the storage modulus (up to 183%). Therefore, DDSQ and POSS are promising materials for low-stress encapsulation for electronic packaging applications.

引用

页码：1 / 10

页数：10

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