Investigation of the moisture-desorption characteristics of epoxy resin

被引：33

作者：

Lin, Y. C. ^{[1
]}

机构：

[1] Cent S Univ, Sch Mech & Elect Engn, Changsha 410083, Peoples R China

来源：

JOURNAL OF POLYMER RESEARCH | 2006年 / 13卷 / 05期

关键词：

epoxy system; hygrothermal conditions; activation energy; molecular dynamics simulations;

D O I：

10.1007/s10965-006-9053-y

中图分类号：

O63 [高分子化学（高聚物）];

学科分类号：

070305 ; 080501 ; 081704 ;

摘要：

Moisture-diffusion characteristics, which include weight changes, hygrothenrially induced expansion, diffusion coefficients, and activation energy, have been investigated for epoxy resins. The experimental results show that hygroscopic swelling behavior of the epoxy system is consistent; it increases with temperature and decreases sharply at approximately 135 degrees C. Desorption from high moisture saturation tended to leave a small residual moisture content which could be removed only by heating at relatively high desorption temperatures. Further interpretation of this phenomenon are discussed on the basis of experimental results and molecular dynamics (MD) simulations.

引用

页码：369 / 374

页数：6

共 50 条

[1] Investigation of the Moisture-Desorption Characteristics of Epoxy Resin
Y. C. Lin
Journal of Polymer Research, 2006, 13 : 369 - 374
[2] Analysis of thermodynamic properties of moisture-desorption isotherms of Eucalyptus gomphocephala wood
Habouria, Mariam
Ouertani, Sahbi
Azzouz, Soufien
Hermassi, Imene
Elaieb, Mohamed Tahar
WOOD MATERIAL SCIENCE & ENGINEERING, 2023, 18 (03) : 1094 - 1104
[3] MOISTURE IN EPOXY-RESIN COMPOSITES
MAROM, G
BROUTMAN, LJ
JOURNAL OF ADHESION, 1981, 12 (02): : 153 - 164
[4] Investigation of the curing characteristics of wet laminating epoxy resin systems
Hayes, BS
Gilbert, EN
Seferis, JC
Tytus, WB
ADVANCED MATERIALS & PROCESSES PREPARING FOR THE NEW MILLENNIUM, 1999, 31 : 456 - 462
[5] Water absorption and desorption in an epoxy resin with degradation
Xiao, GZ
Shanahan, MER
JOURNAL OF POLYMER SCIENCE PART B-POLYMER PHYSICS, 1997, 35 (16) : 2659 - 2670
[6] Investigation of Moisture Influence on Structure and Thermal Conductivity of Epoxy Resin by Molecular Dynamics Simulation
Sheng, Can
He, Tao
Zhang, Wenze
Wang, Shizhao
Liu, Sheng
2023 24TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT, 2023,
[7] Investigation of the Dielectric Characteristics of Banana Residue-Reinforced Epoxy Resin
Rajamanikandan, T.
Banumathi, S.
Asokan, R.
INTERNATIONAL JOURNAL OF ELECTROCHEMICAL SCIENCE, 2021, 16 (12):
[8] Moisture sorption-desorption-resorption characteristics and its effect on the mechanical behavior of the epoxy system
Lin, YC
Chen, X
POLYMER, 2005, 46 (25) : 11994 - 12003
[9] Moisture absorption and desorption characteristics for woodceramics
Hayashi, Toshinori
Mori, Yoshihiro
Murakami, Masato
Okabe, Toshihiro
Transactions of the Materials Research Society of Japan, Vol 31, No 4, 2006, 31 (04): : 933 - 936
[10] A fully coupled diffusion-reaction scheme for moisture sorption-desorption in an anhydride-cured epoxy resin
El Yagoubi, Jalal
Lubineau, Gilles
Roger, Frederic
Verdu, Jacques
POLYMER, 2012, 53 (24) : 5582 - 5595

← 1 2 3 4 5 →