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- [5] STRESS INTENSITY FACTOR ANALYSIS OF AN INTERFACIAL CORNER BETWEEN PIEZOELECTRIC BIMATERIALS IN A TWO DIMENSIONAL STRUCTURE USING THE H-INTEGRAL METHOD PROCEEDINGS OF THE ASME PACIFIC RIM TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC SYSTEMS, MEMS AND NEMS 2011, VOL 1, 2012, : 463 - 471
- [7] Stress intensity factor for a planar interfacial crack in three dimensional bimaterials Nihon Kikai Gakkai Ronbunshu, A Hen/Transactions of the Japan Society of Mechanical Engineers, Part A, 2007, 73 (03): : 379 - 386
- [9] Stress intensity factor analysis of an interface crack between dissimilar anisotropic materials under thermal stress using the finite element analysis International Journal of Fracture, 2007, 146 : 233 - 248