Structural tests using a MEMS acoustic emission sensor

被引:1
|
作者
Oppenheim, Irving J. [1 ]
Greve, David W. [2 ]
Ozevin, Didem [3 ]
Hay, D. Robert [4 ]
Hay, Thomas R. [5 ]
Pessiki, Stephen P. [6 ]
Tyson, Nathan L. [1 ]
机构
[1] Carnegie Mellon Univ, Dept Civil & Environm Engn, Pittsburgh, PA 15213 USA
[2] Carnegie Mellon Univ, Dept Elect & Comp Engn, Pittsburgh, PA 15213 USA
[3] Phys Acoust Corp, Princeton Jct, NJ 08550 USA
[4] TISEC Inc, Montreal, PQ H4S 1T2, Canada
[5] WavesInSolids LLC, State Coll, PA 16803 USA
[6] Lehigh Univ, Dept Civil & Environm Engn, Bethlehem, PA 18015 USA
基金
美国国家科学基金会; 美国安德鲁·梅隆基金会;
关键词
acoustic emission; MEMS; transducer sensitivity;
D O I
10.1117/12.648676
中图分类号
V [航空、航天];
学科分类号
08 ; 0825 ;
摘要
In a collaborative project at Lehigh and Carnegie Mellon, a MEMS acoustic emission sensor was designed and fabricated as a suite of six resonant-type capacitive transducers in the frequency range between 100 and 500 kHz. Characterization studies showed good comparisons between predicted and experimental electro-mechanical behavior. Acoustic emission events, simulated experimentally in steel ball impact and in pencil lead break tests, were detected and source localization was demonstrated. In this paper we describe the application of the MEMS device in structural testing, both in laboratory and in field applications. We discuss our findings regarding housing and mounting (acoustic coupling) of the MEMS device with its supporting electronics, and we then report the results of structural testing. In all tests, the MEMS transducers were used in parallel with commercial acoustic emission sensors, which thereby serve as a benchmark and permit a direct observation of MEMS device functionality. All tests involved steel structures, with particular interest in propagation of existing cracks or flaws. A series of four laboratory tests were performed on beam specimens fabricated from two segments (Grade 50 steel) with a full penetration weld (E70T-4 electrode material) at midspan. That weld region was notched, an initial fatigue crack was induced, and the specimens were then instrumented with one commercial transducer and with one MEMS device; data was recorded from five individual transducers on the MEMS device. Under a four-point bending test, the beam displayed both inelastic behavior and crack propagation, including load drops associated with crack instability. The MEMS transducers detected all instability events as well as many or most of the acoustic emissions occur-ring during plasticity and stable crack growth. The MEMS transducers were less sensitive than the commercial transducer, and did not detect as many events, but the normalized cumulative burst count obtained from the MEMS transducers paralleled the count obtained from the commercial transducer. Waveform analysis of signals from the MEMS transducers provided additional information concerning arrivals of P-waves and S-waves. Similarly, the analysis provided additional confirmation that the acoustic emissions emanated from the damage zone near the crack tip, and were not spurious signals or artifacts. Subsequent tests were conducted in a field application where the MEMS transducers were redundant to a group of commercial transducers. The application example is a connection plate in truss bridge construction under passage of heavy traffic loads. The MEMS transducers were found to be functional, but were less sensitive in their present form than existing commercial transducers. We conclude that the transducers are usable in their current configuration and we outline applications for which they are presently suited, and then we discuss alternate MEMS structures that would provide greater sensitivity.
引用
收藏
页数:10
相关论文
共 50 条
  • [1] Mechanical behavior of a MEMs acoustic emission sensor
    Bahr, DF
    Wright, JS
    Francis, LF
    Moody, NR
    Gerberich, WW
    MATERIALS FOR MECHANICAL AND OPTICAL MICROSYSTEMS, 1997, 444 : 209 - 214
  • [2] Progress of MEMS acoustic emission sensor: a review
    Zhang, Junhui
    Zhang, Sai
    Yang, Yuhua
    Zhang, Wendong
    SENSOR REVIEW, 2024, 44 (04) : 414 - 428
  • [3] Development of a MEMS acoustic emission sensor system
    Greve, David W.
    Oppenheim, Irving J.
    Wu, Wei
    Wright, Amelia P.
    SENSORS AND SMART STRUCTURES TECHNOLOGIES FOR CIVIL, MECHANICAL, AND AEROSPACE SYSTEMS 2007, PTS 1 AND 2, 2007, 6529
  • [4] MEMS sensor fusion: Acoustic emission and strain
    Saboonchi, Hossain
    Ozevin, Didem
    Kabir, Minoo
    SENSORS AND ACTUATORS A-PHYSICAL, 2016, 247 : 566 - 578
  • [5] Design and testing of a MEMS acoustic emission sensor system
    Greve, David W.
    Oppenheim, Irving J.
    Wright, Amelia P.
    Wu, Wei
    SENSORS AND SMART STRUCTURES TECHNOLOGIES FOR CIVIL, MECHANICAL, AND AEROSPACE SYSTEMS 2008, PTS 1 AND 2, 2008, 6932
  • [6] Multi-frequency MEMS acoustic emission sensor
    Khan, Talha Masood
    Taha, Raguez
    Zhang, Tonghao
    Ozevin, Didem
    SENSORS AND ACTUATORS A-PHYSICAL, 2023, 362
  • [7] Piezoelectric MEMS Acoustic Sensor Array for Wideband Acoustic Emission Sensing
    Khan, Talha Masood
    Merei, Mohammad
    Ozevin, Didem
    EUROPEAN WORKSHOP ON STRUCTURAL HEALTH MONITORING (EWSHM 2022), VOL 1, 2023, 253 : 640 - 645
  • [8] A MULTI-AXIS PIEZORESISTIVE MEMS SENSOR FOR ACOUSTIC EMISSION
    Matsuda, Nobuhiko
    Dung, Nguyen Minh
    Takahata, Tomoyuki
    Shimoyama, Isao
    30TH IEEE INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS (MEMS 2017), 2017, : 1181 - 1183
  • [9] WOOD MONITORING USING MEMS ACOUSTIC SENSOR
    Matsudaira, Kenei
    Nguyen Minh-Dung
    Takei, Yusuke
    Takahata, Tomoyuki
    Matsumoto, Kiyoshi
    Shimoyama, Isao
    2016 IEEE 29TH INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS (MEMS), 2016, : 1122 - 1124
  • [10] BANDWIDTH AND SENSITIVITY ENHANCEMENT OF PIEZOELECTRIC MEMS ACOUSTIC EMISSION SENSOR USING MULTI-CANTILEVERS
    Li, Yongfang
    Omori, Takahiro
    Watabe, Kazuo
    Toshiyoshi, Hiroshi
    2022 IEEE 35TH INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS CONFERENCE (MEMS), 2022, : 868 - 871