Strain compatibility behavior in Cu-6%Ag alloy during drawing into filamentary structure

被引:0
|
作者
Liu Jiabin [1 ]
Meng Liang [1 ]
机构
[1] Zhejiang Univ, Coll Mat Sci & Chem Engn, Hangzhou 310027, Peoples R China
关键词
Cu-Ag alloy; microstructure; strain;
D O I
暂无
中图分类号
TF [冶金工业];
学科分类号
0806 ;
摘要
Cu-6%Ag (mass fraction) microcomposite, of which the primary structure consists of dendritic Cu matrix and non-equilibrium eutectic colonies, was prepared by heavy cold drawing and intermediate heat treatments. The scales of different microstructural components were determined at different draw ratios and the strain compatibility was discussed by evaluating the strain level and strain increase rate for each microstructural component. The microstructural components display different strain levels and strain increase rates in different ranges of drawing strain because both have different characters of strain hardening. Therefore, the strain level and strain increase rate show a non-synchronous increase between both microstructural components with the increase of draw ratio when the microstructural components evolve from original as-cast morphology into filamentary structure.
引用
收藏
页码:931 / 936
页数:6
相关论文
共 15 条
  • [1] Microstructure and strength of wire-drawn Cu-Ag filamentary composites
    Benghalem, A
    Morris, DG
    [J]. ACTA MATERIALIA, 1997, 45 (01) : 397 - 406
  • [2] Cu-Nb alloys prepared by mechanical alloying and subsequent heat treatment
    Botcharova, E
    Freudenberger, J
    Schultz, L
    [J]. JOURNAL OF ALLOYS AND COMPOUNDS, 2004, 365 (1-2) : 157 - 163
  • [3] CLEEMPUT MV, 1996, PHISICA B, V216, P226
  • [4] MICROSTRUCTURE AND ANOMALOUS MECHANICAL-PROPERTIES OF INSITU-PRODUCED SILVER-COPPER COMPOSITE WIRES
    FROMMEYER, G
    WASSERMANN, G
    [J]. ACTA METALLURGICA, 1975, 23 (11): : 1353 - 1360
  • [5] Grünberger W, 2002, Z METALLKD, V93, P58
  • [6] Development of high-strength and high-conductivity conductor materials for pulsed high-field magnets at Dresden
    Grünberger, W
    Heilmaier, M
    Schultz, L
    [J]. PHYSICA B-CONDENSED MATTER, 2001, 294 : 643 - 647
  • [7] Microstructure and tensile properties of nanostructured Cu-25wt%Ag
    Han, K
    Vasquez, AA
    Xin, Y
    Kalu, PN
    [J]. ACTA MATERIALIA, 2003, 51 (03) : 767 - 780
  • [8] The fabrication, properties and microstructure of Cu-Ag and Cu-Nb composite conductors
    Han, K
    Embury, JD
    Sims, JR
    Campbell, LJ
    Schneider-Muntau, HJ
    Pantsyrnyi, VI
    Shikov, A
    Nikulin, A
    Vorobieva, A
    [J]. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 1999, 267 (01): : 99 - 114
  • [9] Microstructural stability and mechanical response of Cu-Ag microcomposite wires
    Hong, SI
    Hill, MA
    [J]. ACTA MATERIALIA, 1998, 46 (12) : 4111 - 4122
  • [10] Ultra-high strength, high conductivity Cu-Ag alloy wires
    Sakai, Y
    SchneiderMuntau, HJ
    [J]. ACTA MATERIALIA, 1997, 45 (03) : 1017 - 1023