Comment on: "Reactive wetting of solders on Cu and Cu6Sn5/Cu3Sn/Cu substrates using wetting balance"

被引：0
|
作者：
Dusek, Karel [1 ]
机构：
[1] Czech Tech Univ, Dept Electrotechnol, Fac Elect Engn, Prague, Czech Republic
来源：
SCRIPTA MATERIALIA | 2021年 / 195卷
关键词：
Wetting test; Wetting balance method; Withdrawing force; Residual force; SURFACE-TENSION;
D O I：
10.1016/j.scriptamat.2021.113728
中图分类号：
TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
In this contribution, as comments to the paper in Scripta Materialia, Volume 55, Issue 9, Pages 823-826, November 2006, will be shown that the residual force marked as Fd is not correctly described. This residual force is recorded during wetting force measurement by wetting balance method, and it was wrongly used as a part of withdrawal force Fwd. The correct relation between residual force Fd and withdrawal force Fwd will be explained more deeply in this comment. (c) 2021 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
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