An investigation of thermal asperity sensors during contact with disk asperities

被引：11
|
作者：
Zhang, Chuanwei [1 ,2 ]
Ovcharenko, Andrey [3 ]
Yang, Min [3 ]
Knudson, Neil [3 ]
Talke, Frank E. [2 ]
机构：
[1] Harbin Inst Technol, Sch Mechatron Engn, Harbin 150006, Peoples R China
[2] Univ Calif San Diego, Ctr Magnet Recording Res, San Diego, CA 92103 USA
[3] Western Digital Corp, San Jose, CA USA
来源：
MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS | 2014年 / 20卷 / 8-9期
关键词：
HEIGHT CONTROL SLIDER; FLYING-HEIGHT; HEAD; SIMULATION; DESIGN;
D O I：
10.1007/s00542-014-2166-z
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
In this study, a thermo-mechanical finite element model was developed for the response of a thermal asperity sensor sliding against a disk asperity. The temperature change of the thermal asperity sensor due to frictional heating was determined. The effect of disk asperity material properties and contact conditions is investigated.
引用
收藏
页码：1529 / 1534
页数：6
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