A simple dislocation model of deformation resistance of ultrafine-grained materials explaining Hall-Petch strengthening and enhanced strain rate sensitivity

被引:132
|
作者
Blum, W. [1 ]
Zeng, X. H. [1 ]
机构
[1] Univ Erlangen Nurnberg, Dept Mat Sci & Engn, Ins Gen Mat Properties 1, D-91058 Erlangen, Germany
关键词
Ultrafine grains; Dislocation generation; Dynamic recovery; Hall-Petch effect; Strain rate sensitivity; FLOW-STRESS; CREEP; BEHAVIOR; TEMPERATURE; BOUNDARIES; TRANSITION; STABILITY; KINETICS; CU;
D O I
10.1016/j.actamat.2008.12.041
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
A model is presented where the properties of ultrafine-grained (UFG) materials are explained in terms of the influence of high-angle boundaries on the rates at which dislocations are stored and recovered at the boundaries. The model reproduces the experimental observations that UFG materials reach a steady state where the deformation resistance is independent of strain. that the strain rate sensitivity, of flow stress is relatively high and that the steady-state flow stress increases inversely with the square root of,rain size. The model results are compared to experimental data for UFG Cu and nanostructured Ni. (C) 2009 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
引用
收藏
页码:1966 / 1974
页数:9
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