Improved trench MOS barrier Schottky rectifier by dielectric engineering

被引:11
|
作者
Wang Ying [1 ]
Xu Likun [1 ]
Ding Kun [1 ]
机构
[1] Harbin Engn Univ, Coll Informat & Commun Engn, Harbin 150001, Peoples R China
关键词
D O I
10.1049/iet-pel.2013.0173
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
An improved trench MOS barrier Schottky (TMBS) rectifier by dielectric engineering variable K TMBS (VK-TMBS) is proposed and studied by two-dimensional numerical simulations. The device shows increasing forward current density and reduction in specific on-resistance (R-sp), as compared with a regular TMBS rectifier. VK-TMBS attains a breakdown voltage of 140 V, which is larger than that of the original TMBS. The forward voltage drop of TMBS is 0.64 V at 180 A/cm(2), and that of VK-TMBS is 0.59 V. The R-sp of VK-TMBS is 26.7% smaller than that of the TMBS. The numerical simulation results indicate that the proposed device features high performance with an improved figure of merit.
引用
收藏
页码:325 / 329
页数:5
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