Finite element modeling and analysis of adhesive layer effects in surface-bonded piezoelectric sensors and actuators including non-uniform thickness

被引:11
|
作者
Velasquez, Jelder Q. [1 ]
Trindade, Marcelo A. [1 ]
机构
[1] Univ Sao Paulo, Sao Carlos Sch Engn, Sao Carlos, SP, Brazil
关键词
Adhesive layer; bonding layer; electromechanical coupling coefficient; finite element model; piezoelectric materials; smart structures;
D O I
10.1080/15376494.2021.1907490
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
A finite element model for multi-functional structures containing surface-bonded piezoelectric patches is proposed with two main objectives: to reduce the computational cost of detailed and accurate analyses; and to fully account for the adhesive layer between structure and patches, including non-uniform thickness. The proposed model is verified and used to assess the effect of adhesive layer properties on the performance of piezoelectric sensors and actuators, based on frequency responses and effective electromechanical coupling coefficient. Results indicate that increases of bonding layer thickness and thickness non-uniformity are not always detrimental to the actuation/sensing performance and could be explored as design parameters.
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页码:3658 / 3673
页数:16
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