Reason Analysis and Repair Measures of Cracked Die

被引：0
|
作者：
Wang, Jing [1 ]
Wang, Yong [2 ]
机构：
[1] Chong Qing Technol & Business Inst, Dept Automot Engn, Chongqing, Peoples R China
[2] Chong Qing Coll Elect Engn, Dept Automot Engn, Chongqing, Peoples R China
来源：
ADVANCES IN APPLIED SCIENCES AND MANUFACTURING, PTS 1 AND 2 | 2014年 / 850-851卷
关键词：
Hypermesh; LS-DYNA; Die; Crack; Strength Limit;
D O I：
10.4028/www.scientific.net/AMR.850-851.296
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
The stress nephogram was obtained through analyzing the stress of die using the finite element software. Cause of die crack is determined from the stress nephogram, and repair plan is presented. The repair plan is analyzed by finite element and is validated by experiment.
引用
收藏
页码：296 / +
页数：2
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