Effects of laser cutting process parameters on cut quality of thin ceramic plate

Straight line laser cuts were performed on alumina ceramic workpiece of 0.85mm thick. The process parameters involved were: laser power (200-400W), pulse rate (10-20Hz) and cutting velocity (200-350mm/min). Each cut was cross-sectioned to reveal the cut kerf profile for observation and measurement of the quality parameters: top width, minimum width and kerf wall profile. Top Width and minimum width decreases with increasing cutting velocity. Decreasing pulse rate increases the top width. There is no distinct trend on how power or pulse rate affect the minimum width. A very general trend shows that low power or low pulse rate results in low minimum width value but the results are not very consistent. There were cases where high power or high pulse rate corresponds to zero minimum width ie. the workpiece was not penetrated.