Correlative multimodal imaging and targeted lasering for automated high-precision IC decapsulation

Performing failure analysis, circuit edits, and quality control checks on microelectronics calls for the ability to reliably decapsulate these devices. Existing methods for decapsulation suffer from multiple challenges, including but not limited to unpredictable process variations, damage to the bond wires and the die, lack of a systematic and reliable workflow, high dependence on the operator and lack of automation. To address these challenges, we propose a correlative workflow that combines multimodal imaging and targeted lasering for automated, high precision decapsulation of integrated circuits (ICs). A femtosecond laser system is used for high-throughput, high-precision, athermal material removal. X-ray computed tomography is used for acquiring a highresolution guide map for material removal, non-destructively. Optical and laser confocal microscopy are used for monitoring the procedure and providing feedback to the lasering component. Scanning electron microscopy is used for final verification of the decapsulation outcome, in combination with in situ bond wire pull testing. We show the application of proposed workflow for decapsulation of three ICs.