Temperature dependence of pixel multichip module operating performance

被引:0
|
作者
Turqueti, MA [1 ]
Appel, JA [1 ]
Christian, DC [1 ]
Cihangir, S [1 ]
Hall, BK [1 ]
Kwan, S [1 ]
Zimmermann, S [1 ]
机构
[1] Fermilab Natl Accelerator Lab, Batavia, IL 60510 USA
关键词
D O I
暂无
中图分类号
TL [原子能技术]; O571 [原子核物理学];
学科分类号
0827 ; 082701 ;
摘要
At Fermilab, a research program to develop a pixel detector for the BTeV experiment has been ongoing for the last several years. The basic building block of the pixel detector is the pixel multichip module. Prototypes have been built and characterization tests have been performed to verify that the pixel module will meet the stringent requirements of the experiment. One of these requirements is that the operating temperature of the detector will be at -5degreesC, which imposes severe constraints on the pixel multichip module packaging design. This paper presents the temperature dependence of prototypes of the pixel multichip module.
引用
收藏
页码:581 / 585
页数:5
相关论文
共 50 条
  • [1] Pixel Multichip Module Development at Fermilab for the PHENIX Experiment
    Turqueti, M. A.
    Andresen, J.
    Brooks, M. L.
    Butsyk, S. A.
    Cardoso, G.
    Christian, D.
    Kapustinsky, J.
    Kunde, G. J.
    Kwan, S. W.
    Lee, D. M.
    Rivera, R.
    2006 IEEE NUCLEAR SCIENCE SYMPOSIUM CONFERENCE RECORD, VOL 1-6, 2006, : 496 - 499
  • [2] Development of a high density pixel multichip module at Fermilab
    Zimmermann, S
    Cardoso, G
    Andresen, J
    Appel, JA
    Chiodini, G
    Christian, DC
    Hall, BK
    Hoff, J
    Kwan, SW
    Mekkaoui, A
    Yarema, R
    PROCEEDINGS OF THE SEVENTH WORKSHOP ON ELECTRONICS FOR LHC EXPERIMENTS, 2001, 2001 (05): : 62 - 66
  • [3] Development of a high density pixel multichip module at Fermilab
    Cardoso, G
    Zimmermann, S
    Kwan, SW
    Andresen, J
    Appel, JA
    Cancelo, G
    Christian, DC
    Cihangir, S
    Downing, R
    Hall, BK
    Hoff, J
    Kasper, PA
    Mekkaoui, A
    Yarema, R
    51ST ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2001, : 547 - 551
  • [4] Development of a high density pixel multichip module at Fermilab
    Cardoso, G
    Zimmermann, S
    Andresen, J
    Appel, JA
    Chiodini, G
    Cihangir, S
    Christian, DC
    Hall, BK
    Hoff, J
    Kwan, SW
    Mekkaoui, A
    Yarema, RJ
    IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2002, 25 (01): : 36 - 42
  • [5] Pixel multichip module design for a high energy physics experiment
    Cardoso, G
    Andresen, J
    Appel, JA
    Christian, DC
    Hall, BK
    Kwan, SW
    Turqueti, MA
    Zimmermann, S
    IEEE TRANSACTIONS ON NUCLEAR SCIENCE, 2004, 51 (05) : 2168 - 2173
  • [6] Pixel multichip module design for a high energy physics experiment
    Cardoso, G
    Andresen, J
    Appell, JA
    Chiodini, G
    Christian, DC
    Hall, BK
    Kwan, SW
    Turqueti, MA
    Zimmermann, S
    2003 IEEE NUCLEAR SCIENCE SYMPOSIUM, CONFERENCE RECORD, VOLS 1-5, 2004, : 68 - 72
  • [7] Building pixel detector modules in multichip module deposited technology
    Becks, KH
    Flick, T
    Grah, C
    Gerlach, P
    Mättig, P
    IEEE TRANSACTIONS ON NUCLEAR SCIENCE, 2005, 52 (06) : 3176 - 3180
  • [8] A multichip module, the basic building block for large area pixel detectors
    Becks, KH
    Heijne, EHM
    Middelkamp, P
    Scharfetter, L
    Snoeys, W
    1996 IEEE MULTI-CHIP MODULE CONFERENCE, PROCEEDINGS, 1996, : 16 - 19
  • [9] Fabrication and characterization of a high temperature superconducting multichip module
    Cooksey, JW
    Brown, WD
    Schaper, LW
    Florence, RG
    Scott, SS
    Afonso, S
    PROCEEDINGS OF THE FOURTH SYMPOSIUM ON LOW TEMPERATURE ELECTRONICS AND HIGH TEMPERATURE SUPERCONDUCTIVITY, 1997, 97 (02): : 100 - 107
  • [10] Junction temperature simulation of multichip module LED package
    Ahn, J.
    Kim, D.
    Lee, C. R.
    Baek, B. J.
    MATERIALS RESEARCH INNOVATIONS, 2014, 18 : 748 - 752