Development of Polymer-high-k P-ceramic-functional Composites for Applications as Embedded Capacitors

被引:2
|
作者
Hanemann, T. [1 ,2 ]
Schumacher, B. [1 ,2 ]
机构
[1] Karlsruhe Inst Technol, Inst Mat Res, Karlsruhe, Germany
[2] Univ Freiburg, Dept Microsyst Engn, Freiburg, Germany
关键词
polymer-nanocomposites; high-k-ceramics; embedded capacitors; BARIUM-TITANATE CERAMICS; DIELECTRIC-PROPERTIES; GRAIN-SIZE; NANOCOMPOSITES;
D O I
10.3850/978-981-08-6555-9_128
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
A series of polyester -based composites containing nanosized high-k-ceramics like TiO2, BaTiO3 and SrTiO3 have been investigated with respect to the use as potential materials for embedded capacitors. The polymerization of the unsaturated polyester resin containing styrene as reactive thinner is insensitive to slight variations in the polymerization conditions applying a cold hardener as initiator and delivers a polymer with an average molecular mass Mw around 7000. The solid polymer shows after polymerization a thermal stability up to 200 degrees C and a permittivity around 3. The polymer's permittivity can be further elevated by doping with an electron rich organic molecule like phenanthrene up to a value around 5. Composites containing up to 40 vol% ceramic load have been prepared by simple mixing using a dissolver stirrer and solidified by curing. Permittivity values around 18 and low dielectric losses around 0.02 have been achieved using 100 nm particle sized BaTiO3 filler. The relative low values are due to small grain sizes which are accompanied with a suppression of the high-k-tetragonal phase.
引用
收藏
页码:227 / 230
页数:4
相关论文
共 50 条
  • [1] Dielectric Properties of Polymer-ceramic Composites for Embedded Capacitors
    Yoon, Jung-Rag
    Han, Jeong-Woo
    Lee, Kyung-Min
    Lee, Heun-Young
    TRANSACTIONS ON ELECTRICAL AND ELECTRONIC MATERIALS, 2009, 10 (04) : 116 - 120
  • [2] Factors influencing the permittivity of polymer/ceramic composites for embedded capacitors
    Ogitani, S
    Bidstrup-Allen, SA
    Kohl, PA
    IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2000, 23 (02): : 313 - 322
  • [3] Embedded sigh K ceramic capacitors in LTCC for wireless communication applications
    Ehlert, MR
    Branchevsky, S
    1999 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, PROCEEDINGS, 1999, 3906 : 653 - 657
  • [4] Development of high-K photo-definable epoxy composites for embedded capacitors
    Ogitani, S
    Bidstrup-Allen, SA
    Kohl, P
    TWENTY THIRD IEEE/CPMT INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY SYMPOSIUM, 1998, : 199 - 205
  • [5] Operational Performances Demonstration of Polymer-Ceramic Embedded Capacitors for MMIC Applications
    Bord-Majek, Isabelle
    Kertesz, Philippe
    Mazeau, Julie
    Caban-Chastas, Daniel
    Levrier, Bruno
    Bechou, Laurent
    Ousten, Yves
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2011, 1 (09): : 1473 - 1479
  • [6] Realization of embedded capacitors using polymer matrix composites with barium titanate as high-k-active filler
    Hanemann, Thomas
    Schumacher, Benedikt
    MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2012, 18 (06): : 745 - 751
  • [7] Realization of embedded capacitors using polymer matrix composites with barium titanate as high-k-active filler
    Thomas Hanemann
    Benedikt Schumacher
    Microsystem Technologies, 2012, 18 : 745 - 751
  • [8] Polymer ceramic composites for high thermal load applications
    Schubert, R.
    Tupaika, F.
    Kuhn, J.
    Keramische Zeitschrift, 2007, 59 (02) : 94 - 99
  • [9] High dielectric ceramic nano particle and polymer composites for embedded capacitor
    Takahashi, A
    Kakimoto, M
    Tsurumi, TA
    Hao, JJ
    Li, L
    Kikuchi, R
    Miwa, T
    Oono, T
    Yamada, S
    JOURNAL OF PHOTOPOLYMER SCIENCE AND TECHNOLOGY, 2005, 18 (02) : 297 - 300
  • [10] Development of new polymer–BaTiO3-composites with improved permittivity for embedded capacitors
    Thomas Hanemann
    Holger Gesswein
    Benedikt Schumacher
    Microsystem Technologies, 2011, 17 : 195 - 201