Polyimide multi-layer substrate for high-density semiconductor package

被引：0
|
作者：
Takenaka, Shoichi [1 ]
Kishihara, Ryoichi [1 ]
Okamoto, Masahiro [1 ]
Ito, Shoji [1 ]
Nakao, Osamu [1 ]
机构：
[1] Fujikura Ltd, Circuit Technol R&D Dept, Sakura, Chiba 2858550, Japan
来源：
Advances in Electronic Packaging 2005, Pts A-C | 2005年
关键词：
polyimide; multi-layer substrate; interstitial via hole; conductive paste;
D O I：
10.1115/IPACK2005-73065
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
We have developed a polyimide multi-layer substrate for semiconductor package. Interstitial via holes filled with conductive paste make the electrical connection in any layers in the multi-layer substrate to realize high-density wiring. The substrate shows reliable resistance to moisture and heat. Use of polyimide film make the substrate considerable thin compared to the conventional method using glass-epoxy. The present multi-layer substrate can be applied to a promising interposer for high-density semiconductor such as multi-chip module and stacked chip.
引用
收藏
页码：1779 / 1782
页数：4
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