Effect of hygroscopic swelling of mold compound on PEM reliability

被引：0
|
作者：
Han, B [1 ]
Stellrecht, E [1 ]
Pecht, M [1 ]
机构：
[1] Univ Maryland, Dept Mech Engn, CALCE Elect Prod & Syst Ctr, College Pk, MD 20742 USA
来源：
ELECTRONIC AND PHOTONIC PACKAGING, ELECTRICAL SYSTEMS AND PHOTONIC DESIGN AND NANOTECHNOLOGY - 2003 | 2003年
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D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
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页码：371 / 372
页数：2
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