Effect of transient liquid-phase bonding variables on the properties of a micro-duplex stainless steel

The TLP bonding process has been used to join a 2205 micro-duplex stainless steel using a pure copper interlayer and a foil based on the Fe-B-Si ternary system. Joints were produced by isothermal solidification when using these interlayers, and the rapid heating and cooling cycles used during bonding suppressed the formation of a-phase within the joint region. Metallographic examination of the bonds show that a homogeneous microstructure with grain growth and good alpha/gamma phase balance across the bond-line was achieved, and this gave the joint mechanical and corrosion-resistant properties similar to that of the parent alloy. (C) 2004 Elsevier B.V. All rights reserved.