Hydrogen engineering via plasma immersion ion implantation and flash lamp annealing in silicon-based solar cell substrates

被引:13
|
作者
Bregolin, F. L. [1 ]
Krockert, K. [2 ]
Prucnal, S. [1 ]
Vines, L. [3 ]
Huebner, R. [1 ]
Svensson, B. G. [3 ]
Wiesenhuetter, K. [1 ]
Moeller, H. -J. [2 ]
Skorupa, W. [1 ]
机构
[1] Helmholtz Zentrum Dresden Rossendorf, Inst Ion Beam Phys & Mat Res, D-01314 Dresden, Germany
[2] TU Bergakad Freiberg, Inst Expt Phys, D-09599 Freiberg, Germany
[3] Univ Oslo, Dept Phys, Ctr Mat Sci & Nanotechnol, N-0316 Oslo, Norway
关键词
SEMICONDUCTOR-MATERIALS; SURFACE PASSIVATION; EMITTERS; FILMS;
D O I
10.1063/1.4865737
中图分类号
O59 [应用物理学];
学科分类号
摘要
Higher conversion efficiencies while reducing costs at the same time is the ultimate goal driving the advancement of solar cell development. In this work, solar cell emitters are formed in Si substrates by plasma immersion ion implantation (PIII) of phosphine and posterior millisecond-range flash lamp annealing (FLA). In Si-based solar cells, hydrogen plays a fundamental role due to its excellent passivation properties. The optical and electrical properties of the fabricated emitters will be studied, with particular interest in their dependence on the hydrogen content present in the samples. The influence of different FLA annealing parameters and a comparison with traditional thermal treatments such as rapid thermal annealing (RTA) and furnace annealing (FA) will be presented. The samples treated by FLA at 1200 degrees C for 20 ms in forming gas show sheet resistance values of the order of 60 Omega/square, and minority carrier diffusion lengths in the range of similar to 200 mu m without the use of a capping layer for surface passivation. Those results are significantly better than the ones observed from RTA or FA annealed samples. The simultaneous implantation of hydrogen during the doping process, combined with optimal FLA annealing parameters, gave promising results for the application of this technology in replacing the conventional POCl3 deposition and diffusion. (C) 2014 AIP Publishing LLC.
引用
收藏
页数:6
相关论文
共 41 条
  • [1] Metallic contamination in hydrogen plasma immersion ion implantation of silicon
    Chu, PK
    Fu, RKY
    Zeng, XC
    Kwok, DTK
    JOURNAL OF APPLIED PHYSICS, 2001, 90 (08) : 3743 - 3749
  • [2] Formation of InAs quantum dots in silicon by sequential ion implantation and flash lamp annealing
    Prucnal, S.
    Turek, M.
    Drozdziel, A.
    Pyszniak, K.
    Zhou, S. Q.
    Kanjilal, A.
    Skorupa, W.
    Zuk, J.
    APPLIED PHYSICS B-LASERS AND OPTICS, 2010, 101 (1-2): : 315 - 319
  • [3] Formation of InAs quantum dots in silicon by sequential ion implantation and flash lamp annealing
    S. Prucnal
    M. Turek
    A. Drozdziel
    K. Pyszniak
    S. Q. Zhou
    A. Kanjilal
    W. Skorupa
    J. Zuk
    Applied Physics B, 2010, 101 : 315 - 319
  • [4] Plasma immersion ion implantation for tunnel oxide passivated contact in silicon solar cell
    Yamaguchi, Noboru
    Mueller, Ralph
    Reichel, Christian
    Benick, Jan
    Miyajima, Shinsuke
    SOLAR ENERGY MATERIALS AND SOLAR CELLS, 2024, 268
  • [5] Plasma immersion ion implantation of boron for ribbon silicon solar cells
    Derbouz, K.
    Michel, T.
    De Moro, F.
    Spiegel, Y.
    Torregrosa, F.
    Belouet, C.
    Slaoui, A.
    EPJ PHOTOVOLTAICS, 2013, 4
  • [6] The applications of plasma immersion ion implantation to crystalline silicon solar cells
    Liu, Bangwu
    PROCEEDINGS OF THE 3RD INTERNATIONAL CONFERENCE ON CRYSTALLINE SILICON PHOTOVOLTAICS (SILICONPV 2013), 2013, 38 : 289 - 296
  • [7] Annealing effects in samples of silicon implanted with helium by plasma immersion ion implantation
    Reis, JCN
    Beloto, AF
    Ueda, M
    NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION B-BEAM INTERACTIONS WITH MATERIALS AND ATOMS, 2005, 240 (1-2): : 219 - 223
  • [8] Annealing effects on silicon oxynitride layer synthesized by N plasma immersion ion implantation
    Ueda, Mario
    Reuther, Helfried
    Beloto, Antonio Fernando
    Kuranaga, Carlos
    Abramof, Eduardo
    IEEE TRANSACTIONS ON PLASMA SCIENCE, 2006, 34 (04) : 1080 - 1083
  • [9] Contamination issues in hydrogen plasma immersion ion implantation of silicon - a brief review
    Chu, PK
    SURFACE & COATINGS TECHNOLOGY, 2002, 156 (1-3): : 244 - 252
  • [10] Formation of buried porous silicon structure by hydrogen plasma immersion ion implantation
    Fan, Z
    Chu, PK
    Lu, X
    Iyer, SSK
    Cheung, NW
    ADVANCES IN MICROCRYSTALLINE AND NANOCRYSTALLINE SEMICONDUCTORS - 1996, 1997, 452 : 427 - 430