Characterizing CMP pad conditioning using diamond abrasives

被引：0
|
作者：
Dyer, T [1 ]
Schlueter, J [1 ]
机构：
[1] SpeedFam IPEC, STI ILD CMP Proc Dev Program, Chandler, AZ USA
来源：
MICRO | 2002年 / 20卷 / 01期
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：47 / 54
页数：8
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