Carbon and Tungsten Sputtering in a Helium Magnetron Discharge

被引：5
|
作者：
Tiron, Vasile [1 ]
Andrei, Codrin [1 ]
Nastuta, Andrei V. [1 ]
Rusu, George B. [1 ]
Vitelaru, Catalin [1 ]
Popa, Gheorghe [1 ]
机构：
[1] Alexandru Ioan Cuza Univ, Fac Phys, Dept Plasma Phys, Iasi 700506, Romania
来源：
IEEE TRANSACTIONS ON PLASMA SCIENCE | 2009年 / 37卷 / 08期
关键词：
Carbon; magnetrons; sputtering; tungsten; ASDEX UPGRADE; FILMS; DEPOSITION;
D O I：
10.1109/TPS.2009.2024421
中图分类号：
O35 [流体力学]; O53 [等离子体物理学];
学科分类号：
070204 ; 080103 ; 080704 ;
摘要：
This paper reports on carbon and tungsten deposition on a heated silicon substrate under He(+) bombardment in a magnetron-sputtering device. The discharge was operated at constant pressure of 1.33 Pa for two discharge-current intensities (200 and 600 mA) and target power density up to 40 W . cm(-2). The deposited films were characterized by scanning electron microscopy, atomic force microscopy, and X-ray diffractometry. The topography and cross section revealed the influence of the target power density on the surface roughness, grains' size, and thickness of the deposited films.
引用
收藏
页码：1581 / 1585
页数：5
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