Signal Integrity Analysis of Embedded Planar EBG Structures

被引：1
|
作者：
de Paulis, Francesco [1 ]
Raimondo, Leo [1 ]
Orlandi, Antonio [1 ]
机构：
[1] Univ Aquila, Dept Elect Engn, UAq EMC Lab, I-67100 Laquila, Italy
来源：
2010 ASIA-PACIFIC INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY & TECHNICAL EXHIBITION ON EMC RF/MICROWAVE MEASUREMENTS & INSTRUMENTATION | 2010年
关键词：
D O I：
10.1109/APEMC.2010.5475786
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This work analyzes the impact on the signal quality and integrity of embedded planar electromagnetic bandgap structures. The power integrity properties of these structures are related to the transfer function of the interconnects that are routed in between the layers forming the EBG configuration. Two cases are studied: the symmetrical and asymmetrical configuration of the EBG plane. Some design guidelines are developed and offered.
引用
收藏
页码：330 / 333
页数：4
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