Grinding Force and Surface Roughness in Ultrasonic Assisted Grinding of SiC Ceramics with Diamond Grinding Wheel

被引：2
|
作者：
Liu, Lifei [1 ]
Zhang, Feihu [1 ]
Li, Chunhui [1 ]
Chen, Jiang [1 ]
Liu, Minhui [1 ]
机构：
[1] Harbin Inst Technol, Sch Mech & Elect Engn, Harbin 150001, Peoples R China
来源：
ADVANCES IN ABRASIVE TECHNOLOGY XVI | 2013年 / 797卷
关键词：
Ultrasonic assisted grinding; SiC; Grinding force; Surface roughness;
D O I：
10.4028/www.scientific.net/AMR.797.234
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
In this paper, experiments are conducted to study the characters of Ultrasonic Assisted Grinding(UAG) and Conventional Grinding(CG), diamond grinding wheel is used in experiments, grinding forces and surface roughness are measured in both UAG and CG. The effects of different parameters on grinding force, surface roughness and force ratio are discussed. The results show that the grinding force and surface roughness in UAG is smaller than those in CG. The force ratio in UAG is lower than that in CG, which reveals that the grinding wheel has a good wear-resistant property in UAG process.
引用
收藏
页码：234 / 239
页数：6
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