Effect of curing technology on bonding properties of silicate wood adhesive

In order to determine the best curing conditions of silicate wood adhesive, three different curing conditions, i.e. room temperature, moderate temperature, and high temperature were chosen to prepare poplar plywood with silicate adhesive and poplar veneer as raw materials. The optimised curing technology was obtained based on a lot of experimental analysis using the single factor test method and orthogonal test method. The research results showed that the curing conditions have obvious influence on the bonding properties. Compared with the samples which were cured at moderate or high temperature, the specimens cured at room temperature have higher bonding strength and water resistance. The dry and wet bonding strength of poplar plywood prepared from optimised curing technology was 0.89 and 0.61 MPa, respectively, and 24 h thickness swelling rate was 5.6%, these properties reached the Chinese National Standard of II Grade Plywood.