Failure Analysis of Plastic Packages for Low-Power ICs

被引：2
|
作者：
Saponara, Sergio [1 ]
Ciarpi, Gabriele [1 ]
Fanucci, Luca [1 ]
机构：
[1] Univ Pisa, Dip Ingn Informaz, Via G Caruso 16, I-56122 Pisa, Italy
来源：
APPLICATIONS IN ELECTRONICS PERVADING INDUSTRY, ENVIRONMENT AND SOCIETY, APPLEPIES 2016 | 2018年 / 429卷
关键词：
Failure mode and effect analysis (FMEA); Functional safety; Automotive electronics; Integrated Circuits (ICs); Packaging;
D O I：
10.1007/978-3-319-55071-8_21
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The paper analyses the trend in packaging for low-power integrated circuits (IC) and the principal failures that can occur. A Fault-tree (FT) analysis is proposed, as well an analysis of the failure distribution (FD), which can be useful in safety-critical applications such as industrial and automotive.
引用
收藏
页码：160 / 166
页数：7
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