Finite element study of three-dimensional flow and heat transfer in mold filling process

被引:0
|
作者
Park, JS [1 ]
Kim, MS [1 ]
Hur, H [1 ]
Lee, JS [1 ]
Lee, WI [1 ]
机构
[1] Seoul Natl Univ, Sch Mech & Aerosp Engn, Seoul 151, South Korea
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中图分类号
O414.1 [热力学];
学科分类号
摘要
Mold filling process was analyzed on the finite element framework. Mold filling process is a problem involving flow and heat transfer with moving free surfaces. Due to the simplicity and flexibility of the fixed grid system, this study employed the VOF (Volume of Fluid)-based algorithm in solving the moving boundary problem. This study adopted a method in which the shape of the free surface is assumed to be a plane within an element and utilized the concept of the fluid-richness vector (orientation vector) in order to define the plane which identifies the free surface. Combined with the linear geometric representation of the free surface, the semi-implicit scheme with respect to the temporal domain is proposed to advance the flow front. To show the versatility and availability of the current scheme, three-dimensional mold filling processes are simulated.
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页码:75 / 82
页数:8
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