Analysis of PCB Via for Signal Integrity Using ANOVA

被引：0
|
作者：
Zhou, Shilei [1 ]
Guan, Yalin [1 ]
Tang, Xinkun [1 ]
机构：
[1] Commun Univ China, Inst Informat Engn, Beijing, Peoples R China
来源：
ADVANCED RESEARCH IN MATERIAL SCIENCE AND MECHANICAL ENGINEERING, PTS 1 AND 2 | 2014年 / 446-447卷
关键词：
Signal Integrity; Via; Design of Experiments; Orthogonal Array; ANOVA (ANalysis Of VAriance) and HFSS;
D O I：
10.4028/www.scientific.net/AMM.446-447.956
中图分类号：
TH [机械、仪表工业];
学科分类号：
0802 ;
摘要：
This paper based on ANOVA (ANalysis Of VAriance) presents an investigation in the design of signal via in multilayered printed circuit boards (PCB) technology from a signal integrity point of view. Using the concept of the orthogonal array (OA), different via's physical aspect ratios have been set in the analysis. The impacts of these parameters are investigated with the help for a full-wave electromagnetic simulation soft HFSS. This study demonstrates the factors which is the most influence on the signal integrity.
引用
收藏
页码：956 / 960
页数：5
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