Transient thermal analysis of multilayered structures using Green's functions

被引：21
|
作者：
Janicki, M
De Mey, G
Napieralski, A
机构：
[1] Tech Univ Lodz, Dept Microelect & Comp Sci, PL-93590 Lodz, Poland
[2] Univ Ghent, Dept Elect & Informat Syst, B-9000 Ghent, Belgium
来源：
MICROELECTRONICS RELIABILITY | 2002年 / 42卷 / 07期
关键词：
Heat equations - Multilayered structures;
D O I：
10.1016/S0026-2714(02)00082-3
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This paper presents an approach to the analysis of transient thermal states in electronic circuits using an analytical solution of the heat equation. Fully three-dimensional analytical time dependent solutions are determined for multilayered structures with the help of Green's functions (GFs). The GFs required for the solution are found using a Galerkin-based integral method. The entire solution method is illustrated in detail using a practical example, where the results of transient thermal simulations of a real hybrid power module are compared with infrared measurements. (C) 2002 Elsevier Science Ltd. All rights reserved.
引用
收藏
页码：1059 / 1064
页数：6
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