A technique is presented for patterning the metal cathode of organic light-emitting diodes that allows for cathode engineering. The technique involves transferring pretreated and prepatterned metal on a substrate onto the surface of organic layers of the device by pressing, utilizing a difference in the adhesion strength of the metal between the substrate and the underlying organic layer. This cathode transfer technique is applied to fabricating a 20x10 passive matrix display with a pixel size of 250 mum by 250 mum. (C) 2002 American Institute of Physics.