Modeling fatigue crack growth in a bimaterial specimen with the configurational forces concept

被引:29
|
作者
Kolednik, Otmar [1 ]
Predan, Jozef [2 ]
Gubeljak, Nenad [2 ]
Fischer, Dieter F. [3 ]
机构
[1] Austrian Acad Sci, Erich Schmid Inst Mat Sci, A-8700 Leoben, Austria
[2] Univ Maribor, Fac Mech Engn, SI-2000 Maribor, Slovenia
[3] Univ Leoben, Inst Mech, A-8700 Leoben, Austria
关键词
Configurational forces; Fatigue crack growth; Inhomogeneous material; Crack-tip shielding; Finite element modeling; ELASTIC-PLASTIC MATERIALS; INHOMOGENEOUS MATERIALS; DRIVING-FORCE; FRACTURE-BEHAVIOR; YIELD STRESSES; INTERFACE; PROPAGATION; THRESHOLD; COMPOSITE; SYSTEM;
D O I
10.1016/j.msea.2009.04.059
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
A two-dimensional finite element analysis is performed to model the behavior of fatigue cracks in bimaterial specimens made of diffusion-bonded ARMCO-iron and SAE 4340 steel with an interface perpendicular to the crack plane. The numerical analyses are based on experiments conducted by Pippan et al. [Mater. Sci. Eng. A 283 (2000) 225-233]. The concept of configurational forces is used to evaluate by post-processing the crack-tip shielding and anti-shielding effects that occur due to the differences in yield stress, hardening and coefficients of thermal expansion of ARMCO-iron and SAE 4340 steel. For given values of applied stress intensity range Delta K(app) and applied load ratio R(app), the near-tip J-integral J(tip) is calculated at the maximum and minimum load. To allow for crack closure, the effective near-tip stress intensity range Delta K(eff.tip) is evaluated from the near-tip stress intensity range Delta K(tip) and the near-tip load ratio R(tip). Calibration curves for homogeneous ARMCO-iron and SAE 4340 steel are used to calculate the crack growth rate da/dN from the values of Delta K(eff.tip). The distance between interface and crack tip L is varied to simulate the behavior of a growing crack. The computed curves da/dN versus L curves are in good agreement with the experimental results. (C) 2009 Elsevier B.V. All rights reserved.
引用
收藏
页码:172 / 183
页数:12
相关论文
共 50 条
  • [1] Accelerated fatigue crack growth simulation in a bimaterial interface
    Moslemian, R.
    Karlsson, A. M.
    Berggreen, C.
    INTERNATIONAL JOURNAL OF FATIGUE, 2011, 33 (12) : 1526 - 1532
  • [2] FATIGUE-CRACK GROWTH AT ARBITRARY ANGLES TO BIMATERIAL INTERFACES
    SUGIMURA, Y
    GRONDIN, L
    SURESH, S
    SCRIPTA METALLURGICA ET MATERIALIA, 1995, 33 (12): : 2007 - 2012
  • [3] Analysis of the Bimaterial Interface Cracks Based on Configurational Forces
    Liu, Ran
    Li, Qun
    JOURNAL OF APPLIED MECHANICS-TRANSACTIONS OF THE ASME, 2021, 88 (10):
  • [4] Residually Stressed Bimaterial Beam Specimen for Measuring Environmentally Assisted Crack Growth
    S.J. Grutzik
    S. Aduloju
    T. Truster
    E.D. Reedy
    Experimental Mechanics, 2021, 61 : 411 - 418
  • [5] Residually Stressed Bimaterial Beam Specimen for Measuring Environmentally Assisted Crack Growth
    Grutzik, S. J.
    Aduloju, S.
    Truster, T.
    Reedy, E. D.
    EXPERIMENTAL MECHANICS, 2021, 61 (02) : 411 - 418
  • [6] THE GROWTH OF A FATIGUE CRACK APPROACHING A PERPENDICULARLY-ORIENTED, BIMATERIAL INTERFACE
    SURESH, S
    SUGIMURA, Y
    TSCHEGG, EK
    SCRIPTA METALLURGICA ET MATERIALIA, 1992, 27 (09): : 1189 - 1194
  • [7] Sensitivity of Fatigue Crack Growth Data to Specimen Geometry
    Stanislav, Seitl
    Pavel, Hutar
    Zdenek, Knesl
    ADVANCES IN FRACTURE AND DAMAGE MECHANICS VII, 2008, 385-387 : 557 - 560
  • [8] Effect of specimen thickness on probabilistic fatigue crack growth
    Kim, SJ
    Oh, SK
    Itagaki, H
    Ishizuka, T
    PROCEEDINGS OF THE SIXTH (1996) INTERNATIONAL OFFSHORE AND POLAR ENGINEERING CONFERENCE, VOL IV, 1996, 1996, : 219 - 226
  • [9] EFFECT OF SPECIMEN THICKNESS ON DELAY IN FATIGUE CRACK GROWTH
    SHIH, TT
    WEI, RP
    JOURNAL OF TESTING AND EVALUATION, 1975, 3 (01) : 46 - 47
  • [10] Effect of specimen thickness on fatigue crack growth rate
    Park, HB
    Lee, BW
    NUCLEAR ENGINEERING AND DESIGN, 2000, 197 (1-2) : 197 - 203