Interfacial thermal conductance of buckling carbon nanotubes

被引:1
|
作者
Xu, Ke [1 ]
Zhang, Jicheng [1 ]
Hao, Xiaoli [1 ]
Wei, Ning [1 ]
Cao, Xuezheng [2 ]
Kang, Yang [1 ]
Cai, Kun [3 ]
机构
[1] Northwest A&F Univ, Coll Water Resources & Architectural Engn, Yangling 712100, Shaanxi, Peoples R China
[2] Univ North Carolina Chapel Hill, Dept Math, Chapel Hill, NC 27514 USA
[3] RMIT, Sch Engn, Ctr Innovat Struct & Mat, Melbourne, Vic 3001, Australia
来源
AIP ADVANCES | 2018年 / 8卷 / 06期
基金
中国国家自然科学基金; 中国博士后科学基金;
关键词
MOLECULAR-DYNAMICS; GRAPHENE; FUNCTIONALIZATION; CONDUCTIVITY; NONCOVALENT;
D O I
10.1063/1.5039499
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Bond transition of sp(2) to sp(3) in carbon nanotube can be realized through bending operation at buckling location, which affects the electronic, mechanical and thermal properties of buckled carbon nanotube. In this work, thermal properties of buckled tri-walled carbon nanotube with sp(3) bonds are explored using molecular dynamics. Our results reveal that interfacial thermal conductance at buckling location is sensitive to the bending angle, which decreases exponentially with increasing bending angle until 90 degree because of increasing the number of interlayer sp(3) bonds. When the bending angle is beyond 90 degree, there are sp(3) bonds formed on the outertube walls which provide new paths for heat transfer. The insight of mechanism of thermal properties is analyzed by determining atomic micro-heat flux scattering. Our findings provide a flexible and applicable method to design thermal management device. This unusual phenomenon is explained by the micro-heat flux migration and stress distributions. (C) 2018 Author(s).
引用
收藏
页数:6
相关论文
共 50 条
  • [1] Interfacial Thermal Conductance Observed to be Higher in Semiconducting than Metallic Carbon Nanotubes
    Kang, Stephen Dongmin
    Lim, Seong Chu
    Lee, Eui-Sup
    Cho, Young Woo
    Kim, Yong-Hyun
    Lyeo, Ho-Ki
    Lee, Young Hee
    [J]. ACS NANO, 2012, 6 (05) : 3853 - 3860
  • [2] Enhancement of Interfacial Thermal Conductance of SiC by Overlapped Carbon Nanotubes and Intertube Atoms
    Deng, Chengcheng
    Yu, Xiaoxiang
    Huang, Xiaoming
    Yang, Nuo
    [J]. JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME, 2017, 139 (05):
  • [3] Analysis of thermal conductance of carbon nanotubes
    Jain, Neeraj
    Harsh
    [J]. EUROPEAN PHYSICAL JOURNAL-APPLIED PHYSICS, 2010, 51 (01): : 10602p1 - 10602p5
  • [4] Thermal Conductance of Buckled Carbon Nanotubes
    Nishimura, Fumio
    Shiga, Takuma
    Maruyama, Shigeo
    Watanabe, Kazuyuki
    Shiomi, Junichiro
    [J]. JAPANESE JOURNAL OF APPLIED PHYSICS, 2012, 51 (01)
  • [5] Interfacial thermal conductance of partially unzipped carbon nanotubes: Linear scaling and exponential decay
    Chen, Xiaobin
    Xu, Yong
    Zou, Xiaolong
    Gu, Bing-Lin
    Duan, Wenhui
    [J]. PHYSICAL REVIEW B, 2013, 87 (15)
  • [6] Interfacial Thermal Transport in Carbon Nanotubes
    Kumar, Satish
    Murthy, Jayathi Y.
    [J]. HT2009: PROCEEDINGS OF THE ASME SUMMER HEAT TRANSFER CONFERENCE 2009, VOL 2, 2009, : 951 - 960
  • [7] INTERFACIAL THERMAL CONDUCTANCE BETWEEN CARBON NANOTUBES FROM NONEQUILIBRIUM GREEN'S FUNCTION METHOD
    Liu, Chenhan
    Wang, Jian
    Chen, Weiyu
    Wei, Zhiyong
    Yang, Juekuan
    Chen, Yunfei
    [J]. PROCEEDINGS OF THE ASME 4TH INTERNATIONAL CONFERENCE ON MICRO/NANOSCALE HEAT AND MASS TRANSFER - 2013, 2014,
  • [8] Thermal conductance for single wall carbon nanotubes
    Zheng, QR
    Su, G
    Hong, JW
    Guo, H
    [J]. EUROPEAN PHYSICAL JOURNAL B, 2002, 25 (02): : 233 - 238
  • [9] Thermal conductance for single wall carbon nanotubes
    Qingrong Zheng
    Gang Su
    Jian Wang
    Hong Guo
    [J]. The European Physical Journal B - Condensed Matter and Complex Systems, 2002, 25 : 233 - 238
  • [10] Thermal conductance and the Peltier coefficient of carbon nanotubes
    Lin, MF
    Chuu, DS
    Shung, KWK
    [J]. PHYSICAL REVIEW B, 1996, 53 (16): : 11186 - 11192