Study of the process in Gallium doped ZnO thin film to apply on plus sensor

被引:0
|
作者
Chen, Yu-Jen [1 ]
Kao, Chen-Yuan [1 ]
Kao, Yu-Xin [1 ]
Huang, Jing-Jie [1 ]
Lin, Yen-Sheng [1 ]
机构
[1] I Shou Univ, Dept Elect Engn, Kaohsiung, Taiwan
关键词
Intermittence Process; Inserted nano-Ag particle process; Gallium-doped ZnO; pulse sensor; RESISTANCE TRANSPARENT ELECTRODE; LIGHT-EMITTING-DIODES; MULTILAYER FILMS; OXIDE; TIN; FABRICATION; ITO/AG/ITO;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this study, the "Intermittence Process" and "Inserted nano Ag particles process" are designed to deposit Gallium-doped ZnO (GZO) thin film and apply on pulse sensor. 300nm GZO thin films had been deposited on a flexible (PC) substrate by radio frequency (RF) sputtering. Intermittence process is designed to improve the quality of the GZO thin film. In order to increase the mobility of carriers, the Cu electrode is used in this process. Another process is to insert the nano Ag particles in GZO thin film without Cu electrode, due to the Ag material has excellent conductive. Two processes of thin film are compared with the change rate of resistivity and mobility after different loading test treatment. As the result, the higher and more stable sensitive of resistance change rate is the process of GZO layer after intermittence process, which has the lowest resistance is 9.98x10(-3)Omega-cm at IN1 treatment, after the Cu electrode is treated to assistance as device, which is proven to have better use on plus sensor now.
引用
收藏
页码:102 / 105
页数:4
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