Thermal management of Fujitsu high-end Unix servers

被引：0

作者：

Wei, Jie ^{[1
]}

Suzuki, Masahiro ^{[1
]}

机构：

[1] Fujitsu Ltd, Corp Prod Technol Grp, Corp Technol Engn Ctr, Kawasaki, Kanagawa 2118588, Japan

来源：

HT2005: PROCEEDINGS OF THE ASME SUMMER HEAT TRANSFER CONFERENCE 2005, VOL 2 | 2005年

关键词：

thermal management; computer; server; air cooling; cooling of electronic equipment;

D O I：

暂无

中图分类号：

O414.1 [热力学];

学科分类号：

摘要：

An overview of system packaging and thermal management of the Fujitsu high-performance Unix server PRIMEPOWER HPC2500 is introduced in the present paper. Each node of the HPC2500 comprises sixteen system boards containing up to 128 SPARC64V CPU processors, with the maximum power dissipation about 30kW. A full configuration of the HPC2500 can be further scaled up to the maximum of 128 nodes, resulting in 16,384 CPU processors installed. Thermal management is introduced from viewpoints of the server-cabinet, system-board and CPU processor module levels, respectively. A design strategy of the forced convection air cooling scheme is outlined, implemented to meet increased demanding requirements of high density packaging, high power and power-density dissipations. Furthermore, thermal challenges, arising from high asymmetric power distributions and dissipations of CPU processors, are investigated for high performance computers. Temperature distributions of the CPU processors, effects of heat spreading materials (HIS) and impacts of thermal interface materials (TIM) on the cooling and packaging designs are also analysed and illustrated.

引用

页码：959 / 965

页数：7

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