80Gbit/s ATM switch MCM based on multi-layer ceramic technology

被引：0
|
作者：
Okazaki, K [1 ]
Sugiura, N [1 ]
Harada, A [1 ]
Yamanaka, N [1 ]
Oki, E [1 ]
机构：
[1] NTT, Network Serv Syst Labs, Musashino, Tokyo 1808585, Japan
来源：
ELECTRONICS LETTERS | 1999年 / 35卷 / 24期
关键词：
D O I：
10.1049/el:19991410
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
An 80Gbit/s asynchronous transfer mode (ATM) switch multichip module (MCM) of dimensions 114 x 160 x 6.5 mm has been fabricated. This MCM can support high-density mounting and high-speed interconnection among large-scale-integrated (LSI) chips. Using LSI, ceramic-substrate, high-speed/high-power connector, and compact liquid-cooling technologies, an 80Gbit/s ATM switching module has been built.
引用
收藏
页码：2074 / 2076
页数：3
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