Thermosonic flip chip bonding for-low cost packaging

被引：0
|
作者：
Tomioka, T [1 ]
Iguchi, T [1 ]
Mori, I [1 ]
Saito, M [1 ]
机构：
[1] Toshiba Co Ltd, Corp Mfg Engn Ctr, Isogo Ku, Yokohama, Kanagawa 2350017, Japan
来源：
2002 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, PROCEEDINGS | 2002年 / 4931卷
关键词：
flip chip; thermosonic bonding; gold ball bump; low-pin-count chip;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
We developed the flip chip bonding method in which gold-ball bumps are formed on a small low-pin-count chip and the bumps are directly bonded onto the substrate electrodes using thermosonic bonding. The bonding experiments were carried out with small 6-pin chips, M-pin chips and ceramic substrates; The effects of characteristic properties of the bonding materials used such as the substrate electrode and bumps on bondability have been clarified. Bondability has been improved through optimization of the loading profile. In addition, we developed a thermosonic flip chip bonder which performs stable bonding at high speed with 1.5 sec/chip.
引用
收藏
页码：360 / 365
页数：6
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