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- [8] Development Status of High Speed Ball Pull for Pb-Free BGA Characterization 32ND IEEE/CPMT INTERNATIONAL ELECTRONIC MANUFACTURING TECHNOLOGY SYMPOSIUM, 2007, : 121 - 125
- [10] Pb-free bumping for high-performance SoC 54TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS, 2004, : 655 - 660