Design, fabrication and characterization of a Q-band patch antenna integrated on stacked interposers

被引：2
|
作者：
Sun, Yunheng [1 ]
Jin, Yufeng [1 ]
Lian, Tingting [2 ]
Ma, Shenglin [2 ]
Yang, Yuchi [3 ,4 ]
Wang, Wei [3 ,4 ]
Hu, Liulin [4 ]
He, Shuwei [4 ]
机构：
[1] Peking Univ Shenzhen, Grad Sch, Shenzhen 518055, Guangdong, Peoples R China
[2] Xiamen Univ, Dept Mech & Elect Engn, Xiamen 361005, Fujian, Peoples R China
[3] Peking Univ, Natl Key Lab Sci & Technol Micron Nano Fabricat, Beijing 100871, Peoples R China
[4] Chengdu Ganide Technol CO Ltd, Chengdu 610073, Sichuan, Peoples R China
来源：
2020 IEEE 70TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2020) | 2020年
关键词：
Antenna in Package; TSV; Patch Antenna; Cavity; Q-band; Broadband; Silicon Interposer;
D O I：
10.1109/ECTC32862.2020.00347
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
In this study, we present a Q-band patch antenna with an underling cavity integrated on the stacked high-resistivity Si interposers. A process is developed and sample is fabricated. Evaluation is done and the measurement results shows that it has an operating frequency of 32.75GHz, a -10dB bandwidth of 1.04GHz, a maximum gain of 3dB. Those results prove the feasibility of integrating high-frequency antennas with TSV interposer preliminary.
引用
收藏
页码：2230 / 2235
页数：6
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