The influence of additives on the room-temperature recrystallization of electrodeposited copper

被引：0
|
作者：
Stafford, GR [1 ]
Vaudin, MD [1 ]
Moffat, TP [1 ]
Armstrong, N [1 ]
Jovic, VD [1 ]
Kelley, DR [1 ]
机构：
[1] Natl Inst Stand & Technol, Mat Sci & Engn Lab, Gaithersburg, MD 20899 USA
来源：
ELECTROCHEMICAL TECHNOLOGY APPLICATIONS IN ELECTRONICS III | 2000年 / 99卷 / 34期
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D O I：
暂无
中图分类号：
O646 [电化学、电解、磁化学];
学科分类号：
081704 ;
摘要：
The recrystallization behavior of copper, electrodeposited from a copper sulfate - sulfuric acid plating bath into which various combinations of NaCl, sodium 3-mercapto-1 propanesulfonate (MPSA), and polyethylene glycol (PEG) had been added, was examined by x-ray diffraction and 4-point resistivity. Significant room temperature recrystallization and resistance decrease are observed only when MPSA and PEG are present in the electrolyte together, particularly in the presence of chloride. The rate of recrystallization is linked to the grain refinement brought about by different bath chemistries. The significance of halide adsorption on copper additive plating is discussed.
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页码：340 / 350
页数：11
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