Moore's Law Today

被引:6
|
作者
Keyes, Robert W. [1 ]
机构
[1] IBM Corp, Yorktown Hts, NY USA
关键词
Miniature instruments;
D O I
10.1109/MCAS.2008.923058
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The use of components developed on a single piece of silicon has been increased significantly after the invention of the silicon integrated circuit and Moore's law. Larger chips and reduced device dimensions technology also help to develop devices that can be placed on a single chip, that further help for device miniaturization. Development of thin-film capacitors on the side of holes etched into a chip instead of on the surface can reduce the chip area used to develop the capacitors. The increasing complexity of chips and the miniaturization of transistors leads to the development of 'wire-limited chip'. The reduction of the number of pixels or component also lead to develop devices with maximum number of components on a chip of a given area. Moore's law helped manufacturers to develop small-sized components for integrated electronics.
引用
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页码:53 / 54
页数:2
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