EMC Simulation of an Automotive Ethernet Interface

被引：4
|
作者：
Silaghi, Andrei-Marius [1 ]
De Sabata, Aldo [1 ]
机构：
[1] Univ Politehn Timisoara, Dept Measurements & Opt Elect, Timisoara, Romania
来源：
2020 14TH INTERNATIONAL SYMPOSIUM ON ELECTRONICS AND TELECOMMUNICATIONS (ISETC) | 2020年
关键词：
3D Simulation; Automotive; Ethernet; S parameters; PCB;
D O I：
10.1109/isetc50328.2020.9301147
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
A case study concerning application of full-wave electromagnetic (EM) simulation for identifying issues that usually appear at an Ethernet interface from an Automotive module is reported in this paper. By using 3D full EM simulation, the time-to-market of an automotive product can be reduced, by skipping expensive and time-consuming investigations in laboratory. The work has started from the necessity of Automotive products to have Ethernet requirements met, especially the ones related to Electromagnetic Compatibility (EMC). Namely, mode conversion loss and return loss are investigated and several possible solutions for improvement have been considered.
引用
收藏
页码：103 / 106
页数：4
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