Etching characteristics and mechanisms of the MgO thin films in the CF4/Ar inductively coupled plasma

被引:11
|
作者
Efremov, A.
Woo, J. C.
Kim, G. H.
Kim, C. I.
机构
[1] Chung Ang Univ, Sch Elect & Elect Engn, Seoul 156756, South Korea
[2] State Univ Chem, Dept Elect Devices & Mat Technol, Ivanovo 15300, Russia
基金
新加坡国家研究基金会;
关键词
MgO; etch rate; dissociation; ionization; sputtering; desorption; etch mechanism;
D O I
10.1016/j.mee.2006.12.006
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The etching characteristics and mechanisms of MgO thin films in CF4/Ar inductively coupled plasma were investigated. It was found that the changes in gas mixing ratio as well as in gas pressure result in a non-monotonic behavior of the MgO etch rate. Plasma diagnostics by Langmuir probe indicated the noticeable sensitivity of both electron temperature and density to the variations of the processing parameters. The combination of 0-dimensional plasma model with the model of surface kinetics showed that the reason of the nonmonotonic etch rate is connected with the concurrence of physical and chemical pathways in ion-assisted chemical reaction. (c) 2007 Elsevier B.V. All rights reserved.
引用
收藏
页码:638 / 645
页数:8
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