共 50 条
- [1] Analysis of interconnections with BCB for high-speed digital applications 1999 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM DIGEST, VOLS 1-4, 1999, : 205 - 208
- [2] Crosstalk Analysis and Optimization of High-Speed Interconnections 2011 12TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING (ICEPT-HDP), 2011, : 964 - 967
- [3] Macro-modeling of high-speed digital board to package interconnections 2006 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM DIGEST, VOLS 1-5, 2006, : 1959 - +
- [5] COMPUTER-AIDED ANALYSIS OF HIGH-SPEED PACKAGING INTERCONNECTIONS PROCEEDINGS OF THE TECHNICAL CONFERENCE : EIGHTH ANNUAL INTERNATIONAL ELECTRONICS PACKAGING CONFERENCE, 1988, : 601 - 605
- [6] BURIED COAXIAL CONDUCTORS FOR HIGH-SPEED INTERCONNECTIONS IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1987, 10 (02): : 204 - 208
- [7] MODELING AND SIMULATION OF INTERCONNECTIONS IN HIGH-SPEED PACKAGES PROCEEDING OF THE TECHNICAL PROGRAM OF NEPCON WEST 89, VOLS 1 AND 2, 1989, : 698 - 707
- [8] Electrical characterization methods for high-speed interconnections International Journal of Microcircuits and Electronic Packaging, 1995, 18 (03): : 207 - 216