SPI proceedings: Analysis of high-speed digital interfaces in flexible interconnections

被引:0
|
作者
Kotiranta, Pia
Kelander, Ilkka
Rouvala, Markku
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中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
For mobile device applications, the performance of data interconnections has been getting into focus only lately. Requirements for higher performance devices and product miniaturization have been challenging the design of high-speed interconnections, driving the accurate and fast modeling of interconnect circuits. Here the maximum usable data rate analysis of a high-speed serial, camera- and display-like interface on a specific interconnection template is presented. Multiple modelling methods are combined to construct a flexible interconnection concept with various components. The effect of coupled antenna interference on the interconnection signal quality is included in the study.
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页码:231 / 234
页数:4
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