Analysis of Temperature-Dependent Crosstalk for Graphene Nanoribbon and Copper Interconnects

In this article, we proposed a temperature-based crosstalk analysis model for rough edge graphene nanoribbon (GNR) and Cu interconnect. Temperature-dependent crosstalk delay and noise analysis for 16?nm technology node (ITRS-2011) is performed for three different chip-operating temperatures are ?40?C (233?K), i.e. low temperature, 27?C (300?K), i.e. room temperature, and 105?C (378?K), i.e. high temperature. Our analysis shows that, first by increasing the temperature from 233 to 378?K and also by increasing interconnect length from 10 to 100??m, the GNR shows less amount of crosstalk-induced delay compared with Cu interconnect and crosstalk noise increase slightly which indicates the performance degradation and reliability issues, second the GNR-based interconnect produce (%) variation in delay due to crosstalk and crosstalk noise is lesser than Cu interconnect when interconnect length increase from 10 to 100??m by increasing temperature. Hence, GNR interconnect is much more thermally viable as compared with traditional Cu-based interconnect and it is very much useful for nano-scale interconnect modeling.