Special issue on Poly'2000, London - Foreword

被引：0

|

作者：

Michel, B ^{[1
]}

Kishimoto, K

机构：

[1] Fraunhofer Inst IZM, Berlin, Germany

[2] Tokyo Inst Technol, Tokyo, Japan

来源：

JOURNAL OF ELECTRONIC PACKAGING | 2002年 / 124卷 / 04期

关键词：

D O I：

10.1115/1.1497626

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

收藏

页码：317 / 317

页数：1

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