Thermal stability of nickel silicides in different silicon substrates

被引:4
|
作者
Ho, SCH [1 ]
Poon, MC [1 ]
Chan, M [1 ]
Wong, H [1 ]
机构
[1] Hong Kong Univ Sci & Technol, Dept Elect & Elect Engn, Clearwater Bay, Hong Kong
关键词
D O I
10.1109/HKEDM.1998.740198
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Thermal stability of nickel monosilicide (NiSi) on single crystalline silicon (c-Si), poly-crystalline silicon (poly-Si) and amorphous silicon (a-Si) has been investigated. NiSi is stable and can show low resistivity on c-Si and poly-Si up to around 700 degrees C forming gas anneal (FGA), but is quite unstable on a-Si substrate even after corresponding annealing at only 400 degrees C. However, NiSi pure gate formed on poly-Si and a-Si films are both found to be quite stable with temperature up to 1000 degrees C FGA and on 1000 Angstrom gate oxide.
引用
收藏
页码:105 / 108
页数:4
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