Thermal Neutron Absorption in Printed Circuit Boards

被引：3

作者：

Platt, Simon P. ^{[1
]}

August, Shaun ^{[2
]}

MacLeod, Michael ^{[2
]}

Anderson, Michael J. ^{[1
,2
]}

Cheneler, David ^{[1
]}

Monk, Stephen D. ^{[1
]}

机构：

[1] Univ Lancaster, Dept Engn, Lancaster LA1 4YW, England

[2] Innovat Phys Ltd, Shanklin PO37 7JB, England

来源：

IEEE TRANSACTIONS ON NUCLEAR SCIENCE | 2021年 / 68卷 / 04期

基金：

英国工程与自然科学研究理事会;

关键词：

Neutrons; Substrates; Detectors; Printed circuits; Boron; Absorption; Attenuation; printed circuits; reactor instrumentation; ATTENUATION; DETECTORS;

D O I：

10.1109/TNS.2021.3060864

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Measurements and simulations of thermal neutron attenuation by printed circuit boards (PCBs) are compared. Attenuation coefficients in typical epoxy-resin/glass-fiber substrate material can be as high as 2 cm(-1), corresponding to 27% attenuation by 1.6 mm of the substrate. Attenuation is attributed to neutron scattering off hydrogen in the resin acting in synergy with absorption by boron in the glass; this effect is substantially greater than that estimated from absorption by boron alone. Design of thermal neutron detector assemblies should take this attenuation into account and may require board thickness to be minimized or specialized substrate materials to be used.

引用

页码：463 / 469

页数：7

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