Modeling of micro-crack growth during thermal shock based on microstructural images of thermal barrier coatings

被引：30
|
作者：
Shen Wei [1 ]
Fan Qun-bo [1 ]
Wang Fu-chi [1 ]
Ma Zhuang [1 ]
机构：
[1] Beijing Inst Technol, Sch Mat Sci & Engn, Beijing 100081, Peoples R China
来源：
COMPUTATIONAL MATERIALS SCIENCE | 2009年 / 46卷 / 03期
基金：
中国国家自然科学基金;
关键词：
Microstructural image of TBCs; Digital image processing; Finite element grid model; Micro-crack growth; Thermal shock; DYNAMIC FRACTURE;
D O I：
10.1016/j.commatsci.2009.03.039
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Based on digital image processing theory and finite element mesh generation principle, a methodology is proposed to model the micro-crack growth of thermal barrier coatings (TBCs) during thermal shock with the aid of finite element program. Firstly, a microstructural image of plasma sprayed TBCs is transferred to digital image; secondly, a finite element grid model is generated by thresholding segmentation according to the actual microstructure; finally, based on the finite element grid model. the Tuler-Butcher failure criterion is employed to model the micro-crack growth of TBCs during thermal shock. The numerical simulation result agrees well with the experimental result, and the methodology presented in this paper is found to be effective to model the micro-crack growth. (C) 2009 Elsevier B.V. All rights reserved.
引用
收藏
页码：600 / 602
页数：3
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